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HICERAM Wafer

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Overview

About

NGK's HICERAM Wafer consists of 99.99% high purity alumina, enabling translucency, high insulation, and high strength. Large sizes (up to 12 inch) and variant shapes using NGK's original Mold-cast forming are available.

Surface SEM image of
dense poly-crystal structure

Properties

Comparison of Material Properties

  Sapphire HICERAM Alumina SiO2 Si
Structure Single Crystal Al2O3 Poly Crystal Al2O3 Poly Crystal Al2O3 Glass Single Crystal
Purity ≒100% >99.9% >90% ≒100% ≒00%
Total light transmittance 95-100% 95-100% - 100% -
CTE(Coefficient of Thermal Expansion) ppm/K 5 6 7.5 1 2.5
Thermal Conductivity W/mK 38 34 22-27 1 168
Volume Resistivity Ohm-cm 1014 1014 1014 1016 103
Dielectric Constant   11 10 10 3.9 11.8
Grain Size   - <30um ~1um - -
Wafer Size inch <6 (> 8 Costly) <12
(easy to produce large size wafers)
- -  

Possible Applications

  • Base Wafer for CMOS
  • Temporary Support Wafer
  • HICERAM Wafer with Via

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For more information about Translucent Alumina Ceramics HICERAM, click here.

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