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Beryllium Copper Products | Flexible Contact

  • MSDS
  • Contact
Flexible Contact for BGA: 1.27 x 1.27 mm pitch

Flexible Contact for BGA: 1.27 x 1.27 mm pitch

Product Example

1.27 x 1.27 mm pitch/500 pins

1.27 x 1.27 mm pitch/500 pins

1.0 x1.0 mm pitch/1996 pins

1.0 x1.0 mm pitch/1996 pins

Features

  • Despite a thickness of less than 1.0 mm, deflection is half of its thickness
  • Use of reliable beryllium copper contacts achieves necessary low contact resistance and durability for increased number of cycles
  • Electrical contact length is shorter than the length of a conventional probe, allowing transmission of hi-speed signals up to several GHz
  • Easy one-touch replacement reduces total running cost

Applications

Applications
  • Available for the connection of all types of grid-configuration devices
  • Especially optimum for both testing and mounting BGA and LGA
  • Also available for the connection of board to board
  • Suitable for increased pin counts and faster signal transmission

Contact Function

Contact Function

Features

  • With wiping action, two edges successfully break the oxidized surface of solder ball
  • Surface of solder balls is not damaged
  • Two crossing beams achieve self-alignment of solder ball
  • Longer spring length allows large deflection while maintaining short electrical contact length
  • Also available for LGA

Product Variation

  • Pitch: 2.54mm, 1.27mm, 1.00mm, 0.8mm
  • Pin counts: Below 2,000 pins for 1.0 mm pitch; below 3,000 pins for 0.8mm pitch
  • Tip design: 2 beams for BGA, 1-3 beam(s) for LGA

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