Flexible Contact for BGA: 1.27 x 1.27 mm pitch

Product Example

Features

• Despite a thickness of less than 1.0 mm, deflection is half of its thickness
• Use of reliable beryllium copper contacts achieves necessary low contact resistance and durability for increased number of cycles
• Electrical contact length is shorter than the length of a conventional probe, allowing transmission of hi-speed signals up to several GHz
• Easy one-touch replacement reduces total running cost

Applications

• Available for the connection of all types of grid-configuration devices
• Especially optimum for both testing and mounting BGA and LGA
• Also available for the connection of board to board
• Suitable for increased pin counts and faster signal transmission

Contact Function

Features

• With wiping action, two edges successfully break the oxidized surface of solder ball
• Surface of solder balls is not damaged
• Two crossing beams achieve self-alignment of solder ball
• Longer spring length allows large deflection while maintaining short electrical contact length
• Also available for LGA

Product Variation

• Pitch: 2.54mm, 1.27mm, 1.00mm, 0.8mm
• Pin counts: Below 2,000 pins for 1.0 mm pitch; below 3,000 pins for 0.8mm pitch
• Tip design: 2 beams for BGA, 1-3 beam(s) for LGA