Flexible Contact for BGA: 1.27 x 1.27 mm pitch
Product Example
1.27 x 1.27 mm pitch/500 pins
1.0 x1.0 mm pitch/1996 pins
Features
- Despite a thickness of less than 1.0 mm, deflection is half of its thickness
- Use of reliable beryllium copper contacts achieves necessary low contact resistance and durability for increased number of cycles
- Electrical contact length is shorter than the length of a conventional probe, allowing transmission of hi-speed signals up to several GHz
- Easy one-touch replacement reduces total running cost
Applications
- Available for the connection of all types of grid-configuration devices
- Especially optimum for both testing and mounting BGA and LGA
- Also available for the connection of board to board
- Suitable for increased pin counts and faster signal transmission
Contact Function
Features
- With wiping action, two edges successfully break the oxidized surface of solder ball
- Surface of solder balls is not damaged
- Two crossing beams achieve self-alignment of solder ball
- Longer spring length allows large deflection while maintaining short electrical contact length
- Also available for LGA
Product Variation
- Pitch: 2.54mm, 1.27mm, 1.00mm, 0.8mm
- Pin counts: Below 2,000 pins for 1.0 mm pitch; below 3,000 pins for 0.8mm pitch
- Tip design: 2 beams for BGA, 1-3 beam(s) for LGA
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